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Promoting thermoelectric technology to mitigate global climate change
A: Materials
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Displaying 91 - 100 of 403
A2: Medium temperature materials
Solid phase growth of Mg
2
Si thin films on Si(111) and their electrical, structural and optical properties
Tetsuya Hashimoto, Masashi Sawada, Hiroshi Katsumata
Solid phase growth of Mg
2
Si thin films on Si(111) and their electrical, structural and optical properties
Tetsuya Hashimoto, Masashi Sawada, Hiroshi Katsumata
Solid phase growth of Mg
2
Si thin films on Si(111) and their electrical, structural and optical properties
Tetsuya Hashimoto, Masashi Sawada, Hiroshi Katsumata
Chemical synthesis of copper (II) telluride compounds for thermoelectric applications
M. Saleemi
1
, M.Y. Tafti
1
, M. Johnsson
2
, M. Muhammed
1
and M. S. Toprak
1
Exceeding the Filling Fraction Limit: an Approach to Enhancement in ZT of Single-Filled Pr
y
Co
4
Sb
12
Jennifer Graff
1
, Xiaoyu Zeng
2
, Arash Mehdizadeh Dehkordi
1
, Jian He
2
, Terry M. Tritt
1,2
Nanostructuring by cryomilling of undoped ZnSb
X.Song
1
, K.Valset
1
, O.B.Karlsen
1
, J.S.Graff
2
, A.Thøgersen
1,2
, S.Luxsacumar
2
, O.M.Løvvik
1,2
, T.Finstad
1
Thermoelectric Properties of Non-stoichiometric Silver Antimonate
Kensuke Ozawa
1
, Hirofumi Kakemoto
1
, Shin Nishiyama
2
, and Hiroshi Irie
1∗
Effect of Copper Sulfide Composition on its Thermoelectric Performance
*
L.M.Lyu
1
, L.C.Chen
2
andK.H.Chen
1
Influence of In doping on the thermoelectric properties of AgSbTe
2
compound with enhanced figure of merit
Rajeshkumar Mohanraman
1*
and Yang-Yuan Chen
1
Microstructure and Thermoelectric Properties of Cu
2
Sn
1-x
In
x
Se
3
prepared by Self-propagating synthesis following Plasma Activated Sintering
Xin Cheng, Xinfeng Tang*
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ICT2014 July 6-10 2014, Nashville, TN USA
ICT2014 Website
Sorting Categories
A: Materials
A1: Low temperature materials
A2: Medium temperature materials
A3: High temperature materials
A4: Theory - bulk materials
A5: Nanoscale and low dimensional effects
A6: Characterization
A7: Developments in measurement techniques and preparation methods
B: Elements, modules & systems
B1: Contacting and insulation
B2: Module design
B3: Power management and load balancing
B4: Thermal management and dynamics
B5: Energy system design and optimization
B6: DC/DC inverters
B7: Device and system performance
B8: Modelling
C: End use applications and markets
C1: Waste heat recovery
C2: Automotive
C3: Cooling
C4: Generators
C5: Sensors
C6: Novel applications
C7: Markets
Sponsors
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