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Promoting thermoelectric technology to mitigate global climate change
A: Materials
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Displaying 161 - 170 of 403
A2: Medium temperature materials
Reduced lattice thermal conductivity in the high-power-factor Mg
2
Si
0.4
Sn
0.6
materials by Bi-doping
Peng Gao
1
, Isil Berkun
2
, Xu Lu
3
and Tim Hogan
1,2
Reducing thermal conductivity by adding nanoparticles into n-type Mg
2
Si-Mg
2
Sn solid solutions
A. S. Tazebay, C. Yu
Significantly Improved Thermoelectric Property in SnTe Through Indium Doping
Xiaoya Shi
1
, Binghui Ge
1,2
, Yimei Zhu
1
, Qiang Li
1
Significantly Improved Thermoelectric Property in SnTe Through Indium Doping
Xiaoya Shi
1
, Binghui Ge
1,2
, Yimei Zhu
1
, Qiang Li
1
Stable, nanostructured Cu
2
Se with superior thermoelectric performance prepared by an ultra-fast self-propagating high temperature synthesis
Y. G. Yan
1
, F. Fu
1
†, X. L. Su
1
†, X. F. Tang
1
*, Q. J. Zhang
1
, C. Uher
2
Sticking-free synthesis of Mg
2
Si by vertical gradient freezing method using liquid encapsulants
Reo Nakagawa
1
, Hiroshi Katsumata
1
, Shiro Sakuragi
2
, and Satoshi Hashimoto
2
Structure and property relationship of polymer/nanocarbon hybrids for flexible thermoelectric applications
Youngjae Yoo, Kwang Seok Jang, O Hwan Kwon, Cheon Taek Hong, Sung-Goo Lee, Jin Uk Ha
*
, Song Yun Cho
Temperature dependent optical band gap in PbX (X=Te, Se, S)
Z. M. Gibbs
1
, H. Kim
2,3
, M. Kaviany
2
, G. J. Snyder
1
The potential of Copper and Silver Chalcogenides for thermoelectric applications
G. Jeffrey Snyder
The thermoelectric properties of high performance N-type PbTe based materials
Chiachan Hsu
1
, Tsehsiao Lee
1
, Hsushen Chu
1
, Jenndong Hwang
1
, Hungchang Hsu
2
, Tsaikun Huang
2
and Jingyi Huang
2
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ICT2014 July 6-10 2014, Nashville, TN USA
ICT2014 Website
Sorting Categories
A: Materials
A1: Low temperature materials
A2: Medium temperature materials
A3: High temperature materials
A4: Theory - bulk materials
A5: Nanoscale and low dimensional effects
A6: Characterization
A7: Developments in measurement techniques and preparation methods
B: Elements, modules & systems
B1: Contacting and insulation
B2: Module design
B3: Power management and load balancing
B4: Thermal management and dynamics
B5: Energy system design and optimization
B6: DC/DC inverters
B7: Device and system performance
B8: Modelling
C: End use applications and markets
C1: Waste heat recovery
C2: Automotive
C3: Cooling
C4: Generators
C5: Sensors
C6: Novel applications
C7: Markets
Sponsors
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Ferrotec Thermal
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Hotblock Onboard
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Thermion Company
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Xiamen Hicool Electronics