Google Search
A2: Medium temperature materials
Mg2Si-Si composites with eutectic microstructure were synthesized under several conditions and their thermoelectric properties were examined. Eutectic composition (Mg:Si=47:53 in atomic ratio) of Mg and Si were weighed and melted at 1253K in Ar atmosphere. Subsequently, the samples were cooled under the following conditions: (a) slow cooling (approx. 2K/min), (b) natural cooling in electric furnace, and (c) quenching into oil. Average eutectic spacing was decreased with increasing cooling rete: 17 μm for (a), 10 μm for (b), and 2.4 μm for (c). Thermal conductivity was reduced for the sample (c) due to its small eutectic spacing. Seebeck coefficient and electrical conductivity were comparable to those predicted on the basis of the “role of mixture”, except for the sample (c). Details of the results and discussion will be presented at the conference.