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B8: Modelling

Modeling and methodology to extract SPICE compatible parameters for thermoelectric modules

Minseob sim, Hyunbin Park, and Shiho Kim
School of Integrated Technology, Yonsei University

We have derived an analytic model and methodology extracting both intrinsic and extrinsic SPICE compatible model parameters from the manufacturer’s data sheet of thermoelectric coolers and thermoelectric generators.

For the first time, we have extracted effective thermal resistance of the parasitic components composed of the ceramic and copper interconnect layers of the thermoelectric module using QC versus ∆T data of the vendor sheet. We have presented several examples of successful utilization of the model to reproduce accurate performance of the thermoelectric module.

 

Keywords : analytic model, model parameters extraction, intrinsic and extrinsic SPICE compatible model parameters