Google Search

B7: Device and system performance

Reginald D. Pierce and Robert J. Stevens
Rochester Institute of Technology

Module level characterization of thermoelectric modules is critical to validate module models, to compare and optimize fabrication techniques, and to obtain parameters for system design.  Three characterization methods found in literature are compared experimentally using a test stand developed to characterize modules over a wide range of temperatures (100 – 650°C) and under both rapid transient and steady electrical loading conditions.  We characterize thermoelectric modules using the traditional steady state method, a constant heat rate with electric load perturbation method, and a modified Harman method.  Here we present the differences observed, provide explanations for the discrepancies,  and discuss the benefits and shortcomings of the three approaches.