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Displaying 331 - 340 of 547
A5: Nanoscale and low dimensional effects
Field Effect Density Modulation in Nanowires for Large Thermoelectric Power Factors: A Self-Consistent Atomistic Simulation Approach
Neophytos Neophytou
1,2
and Hans Kosina
2
Hierarchical structuring, band alignment and band engineering: The panoscopic approach to thermoelectrics
Mercouri Kanatzidis
Improvement of thermoelectric properties of Si and Ni silicide nanocomposite films by SiGe alloying
N. Uchida
1
, Y. Ohishi
2
,Y. Miyazaki
2
, K. Kurosaki
2
, S. Yamanaka
2
, T. Tada
1
Investigation of Bismuth Telluride Nanotube Thermoelectrics
DukSoo Kim
1
, Renzhong Du
2
, Shih-Ying Yu
3
, Qi Li
2
, Suzanne Mohney
3
, Srinivas Tadigadapa
1
Lattice Thermal Conductivities of Anisotropic Materials with Size Effect
Saburo Tanaka
1
, Masayuki Takashiri
2
, Koji Miyazaki
3
and Naoe Sasaki
1
Low Temperature Thermoelectric Properties and Aging Phenomena of Nanostructure p-type Bi
2-x
Sb
x
Te
3
Dale Hitchcock
1
, Yen-Liang Liu
2
, Yufei Liu
1
, Terry M. Tritt
1
, Jian He
1
, Chia-Jyi Liu
2
Measurements of Thermoelectric Properties of InAs Nanowires
Seong Gi Jeon
1
, Jin Yu
1
, Dong Woo Park
2
, Sang Jun Lee
2
, and Jae Yong Song
2*
Nanometer scale interface engineering boosts the thermoelectric performance of n-type Ti
0.4
Hf
0.6
Ni
1+z
Sn
0.975
Sb
0.025
alloys
Pranati Sahoo, Yuanfeng Liu and Pierre F. P. Poudeu*
Nanostructured copper deficient Cu2Se as a potential thermoelectric material
K. Tyagi, B. Gahtori, B. Sivaiah, A. K. Srivastava and A. Dhar
Nanostructured topological insulators: Unusual thermoelectric materials
Nirpendra Singh, Yasir Saeed, and Udo Schwingenschlogl
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ICT2014 July 6-10 2014, Nashville, TN USA
ICT2014 Website
Sorting Categories
A: Materials
A1: Low temperature materials
A2: Medium temperature materials
A3: High temperature materials
A4: Theory - bulk materials
A5: Nanoscale and low dimensional effects
A6: Characterization
A7: Developments in measurement techniques and preparation methods
B: Elements, modules & systems
B1: Contacting and insulation
B2: Module design
B3: Power management and load balancing
B4: Thermal management and dynamics
B5: Energy system design and optimization
B6: DC/DC inverters
B7: Device and system performance
B8: Modelling
C: End use applications and markets
C1: Waste heat recovery
C2: Automotive
C3: Cooling
C4: Generators
C5: Sensors
C6: Novel applications
C7: Markets
Sponsors
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Alphabet Energy
Ferrotec Thermal
Gentherm
Hotblock Onboard
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Thermion Company
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Xiamen Hicool Electronics