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A1: Low temperature materials
School of Chemical Engineering, Purdue University
Conventional thermoelectric module fabrication requires large amount of raw materials, which leads to high manufacture cost and slow device production. At the same time, the rigid device design brings intrinsic problems such as thermal stress between metal contacts and thermoelectric legs. We developed a dop-coating technique that can fast produce flexible thermoelectric fibers that use much less materials yet possess similar performance. The optimized design could lead to a solution for economically harvesting low-grade heat at reasonably high efficiency.
