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A1: Low temperature materials
Strongly correlated metals are among the few known candidate systems for cryogenic thermoelectric cooling, since they present a rare opportunity for achieving simultaneously large Seebeck coefficients and metallic resistivity at low temperatures. In order to better understand how the thermoelectric properties of these systems might generally be controlled and possibly improved, we have recently explored the structural, magnetic, and electronic transport properties of several compounds in the EuPd3(B,Si)x (0 < x < 0.5) series. We will compare and contrast the effects of boron and silicon filling on the electrical resistivity, Seebeck coefficient, lattice parameter, and magnetization of these materials. We will demonstrate that these properties are intimately connected through the influence of the Eu f levels, which appear to produce an unusual example of ferromagnetic Kondo interactions.
