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B7: Device and system performance
Recently, electrical devices have been required to be cost effective, resource saving, and low energy processing. Printed electronics (PEs) is one of the emerging manufacturing technologies intended to overcome those issues and technological aims. The printing method has attracted a great attention for various applications and components installation, especially electrode or bonding of low temperature packaging technology.
In recent years, the authors have been developing low temperature curing flexible and stretchable isotropic conductive adhesives (ICAs) using several resin materials and silver with different kinds of size or shape for fabrication of electrical devices.
Thermoelectric energy generation (TEG) is one of the utilizing methods of enormous heat energy which is abandoned to the earth. This technology is expected to become an energy harvesting one that can convert the dispersed thermal energy into electrical energy.
Here, we have developed flexible TEG modules for applying to heat sources with the curved surface such as exhaust pipes using ICA packaging technology. The module concept is that a mass of small Bi-Te thermoelectric chips are tightly mounted on a thin film substrate and connected with flexible and stretchable ICAs by printing technique. Fabricated TEG modules with 250 p-n pairs of thermoelectric chips have been evaluated in detail.
